Automatic Encapsulation Machine

Product Details:

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

● Automatic cassette loading, double cassette stacked loading;

● Supports flexible expansion of up to 4 groups of presses to realize high UPH;

● Equipped with vision system to recognize the feeding direction;

● WIN10 + 15 inch touch screen + touch keyboard;

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

Applications:

Semiconductor Molding Machine - TJIN 001

Product Description

The Semiconductor Molding Machine by TJIN is a high-quality and efficient machine designed for use in the production of semiconductors. With a sturdy construction and advanced technology, this machine is perfect for any production facility looking to improve their molding process.

Brand Name

The brand name of this product is TJIN, a trusted and well-known name in the manufacturing industry.

Model Number

The model number of this machine is 001, indicating its advanced and innovative design.

Place of Origin

This product is proudly made in China, known for its high-quality manufacturing and technological advancements.

Certification

This machine has been certified with ISO9001, ensuring its quality and reliability.

Minimum Order Quantity

The minimum order quantity for this product is 1, making it accessible for both small and large scale production facilities.

Packaging Details

The machine is packed in a sturdy wooden packaging, ensuring its safe transport and delivery.

Delivery Time

The average delivery time for this product is 40 days, ensuring a timely and efficient delivery process.

Payment Terms

The payment terms for this product is TT, making it convenient for customers to make payment.

Screw Diameter

The screw diameter of this machine is 35mm, allowing for precise and efficient molding of semiconductors.

Platen Size

The platen size of this machine is 600 x 600mm, providing ample space for large-scale production.

Control System

The control system of this machine is equipped with a PLC, allowing for easy and accurate control of the molding process.

Capacity

With a capacity of 100 tons, this machine can handle high volumes of production without compromising on quality.

Injection Unit

The injection unit of this machine is single, ensuring a streamlined and efficient molding process.

Application

This Semiconductor Molding Machine is suitable for use in various industries such as electronics, automotive, and aerospace. It is especially useful in the production of semiconductors for electronic devices such as smartphones, laptops, and computers.

Scenario

Auto Packaging Equipment, Auto Transfer Molding, and Auto Packaging Equipment are some of the key features of this machine that make it ideal for use in a busy production facility. With its advanced technology and precise control system, this machine can easily integrate into any production line, making the molding process faster and more efficient. The sturdy construction and high-quality components ensure minimal downtime and maximum productivity, making it a valuable asset for any manufacturing company.

Technical Parameters:

FAQ:

• Q: What is the brand name of this product?
• A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
• A: The model number of this product is 001.
• Q: Where is this product made?
• A: This product is made in China.
• Q: Does this product have any certifications?
• A: Yes, this product is ISO9001 certified.
• Q: What is the minimum order quantity for this product?
• A: The minimum order quantity for this product is 1.
• Q: How is this product packaged?
• A: This product is packaged in wooden packaging.
• Q: What is the estimated delivery time for this product?
• A: The estimated delivery time for this product is 40 days.
• Q: What are the payment terms for this product?
• A: The payment terms for this product are TT (Telegraphic Transfer).

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.