Auto Chip Encapsulation System

Packing and Shipping:

Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any damage during transportation.

For international shipping, the equipment is securely strapped onto a pallet and wrapped with stretch film to prevent any shifting during transit.

We offer various shipping options to meet our customers' needs. Standard shipping is available for domestic and international orders, with estimated delivery times provided at the time of purchase. We also offer expedited shipping for urgent orders.

Our team carefully inspects each unit before packaging to ensure that it is in perfect working condition. We also include all necessary manuals and documentation with each shipment.

Please note that any additional fees or taxes associated with customs clearance are the responsibility of the customer.

Thank you for choosing our Semiconductor Molding Equipment. We are committed to providing a seamless and secure shipping experience for our customers.

FAQ:

• Q: What is the brand name of this product?
• A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
• A: The model number of this product is 002.
• Q: Where is this product manufactured?
• A: This product is manufactured in China.
• Q: What type of equipment is Semiconductor Molding Equipment?
• A: Semiconductor Molding Equipment is a type of industrial equipment.
• Q: What is the function of Semiconductor Molding Equipment?
• A: The function of Semiconductor Molding Equipment is to mold semiconductors into specific shapes and sizes.
• Q: Is this product suitable for mass production?
• A: Yes, this product is designed for mass production of semiconductors.
• Q: Does this product require specialized training to operate?
• A: Yes, operators of this product should receive proper training to ensure safe and efficient operation.

Features

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● High efficiency cake loading component, aluminum box loading;

● Automatic cassette loading, double cassette stacked loading;

● Supports flexible expansion of up to 4 groups of presses to realize high UPH;

● Equipped with vision system to recognize the feeding direction;

● WIN10 + 15 inch touch screen + touch keyboard;

● CCD image detection, feeding anti-reverse detection;

● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;

● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;

● Customized on demand, permanently provide quality service.

Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

Technical Parameters:

Customization:

Brand Name: TJIN

Model Number: 002

Place of Origin: China

Control System: PLC (Programmable Logic Controller)

Precision: High

Cycle Time: Short

Material: Plastic

Temperature Control: Precision Temperature Control

Key Features:

• Fully Automatic Molding System
• Automatic Encapsulation System
• Automatic Molding Machine

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.