Semicon Molding System

Product Detail:

• Product Name: Semiconductor Molding Equipment
• Energy Consumption: Low
• Control System: PLC
• Application: Semiconductor Industry
• Molding Method: Injection Molding
• Capacity: High
• Plasticizing Press
• Plasticizing Press
• Plasticizing Press
• PLC Control System

● The automatic plastic seal system is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGDFNOFP and other semiconductor devices. , IC, chip fully automatic plastic seal test.

● Select the molding function, isolation mold function, and the detection function after plastic sealing;

● Use imported raw materials, stable performance, high equipment accuracy, high service life, and ensuring quality;

● Customized on demand, advanced technology, responsible for installing, debugging and training, and providing high -quality services permanently.
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Technical Parameters:

Applications:

TJIN 002 is an advanced molding equipment designed for the semiconductor industry. It is an automatic encapsulation system that uses high precision technology to produce efficient and reliable results. This fully automated molding equipment is manufactured in China by TJIN and is widely used in the semiconductor industry for its cost-effectiveness and advanced technology.

TJIN is a well-known brand in the semiconductor industry, known for its high-quality and reliable products. TJIN 002 is one of their flagship products, designed to meet the specific needs of the semiconductor industry.

The model number 002 signifies that this is the second version of the TJIN semiconductor molding equipment. It is an upgraded and improved version of its predecessor, with enhanced features and capabilities.

TJIN 002 is proudly manufactured in China, a country known for its expertise in the semiconductor industry. The equipment is made with high-quality materials and advanced technology, ensuring its reliability and efficiency.

TJIN 002 is specifically designed for use in the semiconductor industry. It is used for encapsulating and molding semiconductor components, such as integrated circuits, transistors, and diodes. Its high precision and advanced technology make it an ideal choice for this industry.

TJIN 002 is equipped with advanced safety features to ensure the safety of its users and the components being molded. These safety features include automatic shutdown in case of any malfunction, overheat protection, and emergency stop button.

The cycle time of TJIN 002 is short, meaning it can produce a large number of molded components in a short period. This makes it an efficient and time-saving choice for semiconductor manufacturers.

TJIN 002 is primarily made of plastic, a durable and lightweight material that is commonly used in the semiconductor industry. The plastic used in this equipment is of high quality, ensuring the stability and precision of the molding process.

TJIN 002 is a fully automated molding equipment, meaning it requires minimal human supervision. It is equipped with advanced technology and sensors that can automatically detect and correct any errors, making it an efficient and reliable choice for semiconductor manufacturers.

TJIN 002 can be used in various scenarios within the semiconductor industry. Some of the common applications include:

• Encapsulation of integrated circuits
• Molding of transistors and diodes
• Production of semiconductor components
• Manufacturing of electronic devices

TJIN 002 is an advanced and efficient molding equipment designed for the semiconductor industry. Its high precision, reliability, and cost-effectiveness make it a popular choice among semiconductor manufacturers. With its fully automated system and advanced technology, TJIN 002 is a valuable addition to any semiconductor production facility.

Customization:

Brand Name: TJIN

Model Number: 002

Place of Origin: China

Safety Features: Advanced

Temperature Control: Precision Temperature Control

Cycle Time: Short

Molding Method: Injection Molding

Product Type: Molding Equipment

• Automatic Molding Machine
• Automatic Molding Press
• Automatic Molding Machine Supplier

At TJIN, we understand the unique needs of our customers in the semiconductor industry. That's why we offer a comprehensive customization service for our Semiconductor Molding Equipment. With our advanced safety features, precision temperature control, and short cycle time, our equipment is designed to meet the high demands of the industry.

Our customization service allows you to tailor the equipment to your specific needs and requirements. Our experienced team will work closely with you to understand your production process and provide solutions that will optimize your operations.

Whether you need an Automatic Molding Machine, Automatic Molding Press, or are looking for a reliable Automatic Molding Machine Supplier, TJIN has got you covered. Trust us to provide you with the best quality equipment that will enhance your production efficiency and meet your unique demands. Contact us today to learn more about our customization service for Semiconductor Molding Equipment.

Packing and Shipping:

Our Semiconductor Molding Equipment is carefully packaged and shipped to ensure safe delivery to our customers.

The equipment is first wrapped in protective materials to prevent any damage during transportation. It is then placed in a sturdy cardboard box, with additional cushioning materials to further protect it.

We also take extra precautions when packaging delicate components, such as using anti-static materials to prevent any damage from static electricity.

We offer a variety of shipping options to accommodate our customers' needs. Our equipment can be shipped via air, sea, or land depending on the destination and urgency of the order.

We work with trusted shipping partners to ensure timely and safe delivery. Our team also carefully tracks and monitors the shipment to provide updates to our customers.

For international shipments, we handle all necessary customs and documentation to ensure a smooth delivery process.

Before the equipment is shipped, it undergoes a final inspection to ensure it meets our high-quality standards. Any necessary adjustments or repairs are made before packaging to avoid any issues upon delivery.

We take great pride in our packaging and shipping process to ensure our customers receive their Semiconductor Molding Equipment in perfect condition and on time.

FAQ:

• Q: What is the brand name of this product?
• A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
• A: The model number of this product is 002.
• Q: Where is this product made?
• A: This product is made in China.
• Q: What materials are used in this product?
• A: This product is made of high-quality materials such as stainless steel and aluminum.
• Q: What is the capacity of this product?
• A: The capacity of this product is 500 tons per hour.

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.